BASLER
Basler's Embedded Vision Camera Modules enable versatile embedded camera applications. They can be connected to a minicomputer or even directly to a SoC chipset or FPGA processor. You can take advantage of Basler camera modules in a variety of applications from medical devices to code readers or stereo camera systems
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Camera modules are available with USB 3.0, BCON for MIPI and BCON for LVDS interfaces. Basler's pylon Camera Software Suite facilitates software development by providing a unified software interface (API) for camera configuration and image capture across all interfaces. Basler's camera modules, of course, offer excellent quality, as well as compatibility with industrial machine vision standards and GenICam.
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The BCON for MIPI interface developed by Basler is designed for rapid integration with devices that incorporate the MIPI CSI-2 standard video interface. Depending on the model, image preprocessing is done either on the host's ISP circuitry, allowing for highly integrated embedded applications to be built, or in the camera's own FPGA circuitry, providing flexibility in application design. Currently, dart MIPI camera modules are compatible with Qualcomm Snapdragon SoCs and NXP i.MX 8 series processor cards.
Approvals | CE, FCC, GenICam, RoHS, UL, EAC |
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Digital inputs | 2 |
Digital outputs | 2 |
Frame rate max | 60 fps |
Height | 5,3 mm |
Interface | BCON for MIPI |
Length | 27 mm |
Lens barrel | Bare board |
Mono/color | Color |
Pixel size | 2.2 x 2.2 µm |
Power consumption | 0,6 W |
Resolution | 5MP |
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Resolution max | 2560 x 1920 px |
Sensor model | AR0521 |
Sensor size | 1/2.5" |
Sensor supplier | ON Semiconductor |
Sensor Type | CMOS |
Shutter type | Rolling |
Weight | 9 g |
Width | 27 mm |
Basler's Embedded Vision Camera Modules enable versatile embedded camera applications. They can be connected to a minicomputer or even directly to a SoC chipset or FPGA processor. You can take advantage of Basler camera modules in a variety of applications from medical devices to code readers or stereo camera systems
Â
Camera modules are available with USB 3.0, BCON for MIPI and BCON for LVDS interfaces. Basler's pylon Camera Software Suite facilitates software development by providing a unified software interface (API) for camera configuration and image capture across all interfaces. Basler's camera modules, of course, offer excellent quality, as well as compatibility with industrial machine vision standards and GenICam.
Â
The BCON for MIPI interface developed by Basler is designed for rapid integration with devices that incorporate the MIPI CSI-2 standard video interface. Depending on the model, image preprocessing is done either on the host's ISP circuitry, allowing for highly integrated embedded applications to be built, or in the camera's own FPGA circuitry, providing flexibility in application design. Currently, dart MIPI camera modules are compatible with Qualcomm Snapdragon SoCs and NXP i.MX 8 series processor cards.
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Parts | Frame rate max | Height | Length | Lens barrel | Pixel size | Resolution | Resolution max | Sensor model | Sensor size | Weight | Width | Price | ||
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Art:
DAA2500-60MC
Copied
|
60 fps
|
5,3 mm
|
27 mm
|
Bare board
|
2.2 x 2.2 µm
|
5MP
|
2560 x 1920 px
|
AR0521
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1/2.5"
|
9 g
|
27 mm
|
| ||
Art:
DAA2500-60MC/S
Copied
|
60 fps
|
5,3 mm
|
27 mm
|
S-mount
|
2.2 x 2.2 µm
|
5MP
|
2560 x 1920 px
|
AR0521
|
1/2.5"
|
9 g
|
27 mm
|
| ||
Art:
DAA2500-60MCI
Copied
|
60 fps
|
5,3 mm
|
27 mm
|
Bare board
|
2.2 x 2.2 µm
|
5MP
|
2560 x 1920 px
|
AR0521
|
1/2.5"
|
5 g
|
27 mm
|
| ||
Art:
DAA2500-60MCI/S
Copied
|
60 fps
|
5,3 mm
|
27 mm
|
S-mount
|
2.2 x 2.2 µm
|
5MP
|
2560 x 1920 px
|
AR0521
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1/2.5"
|
9 g
|
27 mm
|
| ||
Art:
DAA4200-30MCI
Copied
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30 fps
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5,3 mm
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27 mm
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Bare board
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1.1 x 1.1 µm
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13MP
|
4208 x 3120 px
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AR1335
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1/3"
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5 g
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27 mm
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Art:
DAA4200-30MCI/S
Copied
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30 fps
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17,5 mm
|
29 mm
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S-Mount
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1.1 x 1.1 µm
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13MP
|
4208 x 3120 px
|
AR1335
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1/3"
|
5 g
|
29 mm
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Select a variant in the list
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